Power Module Packaging Design Expert für München gesucht
Arbeits- und Stellenangebot im Regiobizz Arbeitsmarkt
Job Kategorie: Automobil/-zulieferer Technische Berufe
Stellenangebot Basisdaten
- Arbeitsort:
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DE 81673 München
- Umkreis:
-
keine Angabe.
- Art der Arbeitsstelle:
-
- Letze Aktualisierung:
-
31.12.20242024-12-31
Stellenausschreibung: Power Module Packaging Design Expert
- Arbeitgeber bzw.
Arbeitsvermittler
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Li Auto in Hamburg
- Branche
-
Automobil/-zulieferer
- Kategorie
-
Technische Berufe
- Stellenbeschreibung
- About us About Li Auto: We're a leading Chinese new energy vehicle
company that designs, develops, manufactures, and sells premium smart
electric vehicles (EVs). Through product, technology, and business
model innovations, we provide families with safer, more comfortable,
and more convenient products and services. About the team: Our power
module team is one of the leading teams in the power semiconductor
industry, known for its exceptional capabilities and expertise in the
power semiconductor field. With a strong focus on innovation and
cutting-edge research, we have established ourselves as pioneers in
the area of automotive grade SiC device packaging and application. We
welcome candidates who are passionate about pushing the boundaries of
power module packaging and are eager to contribute to our team's
pioneering work. Join our team and be part of an exciting journey
where you can make a significant impact in the field of power
semiconductors. Duties and responsibilities Track industry technology
trends and develop packaging technology roadmaps for power modules;
Responsible for power module product definition, develop power module
product roadmap; Leading the team to complete the pre-research of
advanced packaging solutions, and organize technical cooperation with
universities and research institutes; Leading team to complete the
technical development of advanced power module, output design and
process files; Support product development team to finish product
development and import to factory for mass production. Requirements
Education/Experience Bachelor degree or above in microelectronics,
materials engineering, power electronics, mechanical electronics or
other related majors. More than 8 years of experience in power
semiconductor packaging product development or technology research and
development. Experience in industry-leading product development and
mass production is preferred. Have successful experience in SiC module
development, and those who develop products to achieve mass production
status are preferred. Knowledge Familiar with the overall situation of
semiconductor packaging industry, and have good interpersonal
relationships in industry. Possess a solid theoretical foundation for
the microstructure, basic working principles, common failure modes and
power electronic circuits of power semiconductor devices such as Si,
SiC and GaN. Profound knowledge of packaging system design, thermal
design, electrical design and reliability design, with
industry-leading professional ability in one aspect. Skills and
Competencies Passionate about engineering, with a strong spirit of
innovation. Familiar with the overall situation of semiconductor
packaging industry, and have good interpersonal relationships in the
industry. Familiar with power module design rules as well as
simulation or structure design tools. Proactive, with pioneering
spirit and a good sense of internal and external client. Good command
of English written and oral communication skills. Contact HR: Penny
Email: hupan1@lixiang.com
- Qualifikation
- Arbeitskräfte
- Verdienst:
- n.a.
- Bewerbung an
- Li Auto
Am Strandkai 1
De 20457 Hamburg
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