Expert in Substrate Cutting & Polishing Process (f/m/d) für Weilheim in Oberbayern gesucht

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Job Kategorie: Elektrotechnik/Elektronik Elektrik/Elektronik/Elektrotechnik

Stellenangebot Basisdaten

Arbeitsort:: DE 82362 Weilheim in Oberbayern
Umkreis:: keine Angabe.
Art der Arbeitsstelle:
Letze Aktualisierung:: 30.09.20242024-09-30

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Stellenausschreibung: Expert in Substrate Cutting & Polishing Process (f/m/d)

Arbeitgeber bzw. Arbeitsvermittler: Bertrandt AG in Hamburg

Branche: Elektrotechnik/Elektronik

Kategorie: Elektrik/Elektronik/Elektrotechnik

Stellenbeschreibung: The Bertrandt Group has been providing development solutions for the international automotive and aviation industries as well as the mechanical and plant engineering, energy, medical technology and electronics industries in Europe, China and the USA for more than 40 years. Our employees guarantee extensive know-how, sustainable project solutions and a high level of customer orientation. Expert in Substrate Cutting & Polishing Process (f/m/d) Location: 82362, Munich Expert in Substrate Cutting & Polishing Process (f/m/d) Workplace: 82362, Munich Apply online! What to expect: You will be responsible for the development and execution of projects in the field of cutting and polishing SiC substrates Within your area of responsibility, you will lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues You will become an expert in product reliability requirements, testing methods, and evaluations Your daily focus will be on increasing productivity and tackling major challenges What you bring along: Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry At least 10 years of experience in the introduction or development of processes for cutting and polishing semiconductor substrates Practical experience in the introduction or production of SiC products in fabs is required You are proficient in measurement methods and techniques for evaluating materials and process results Ideally, you are already familiar with the SiC process flow, manufacturing processes, and characterization techniques, and have extensive expertise in semiconductor material processing, preferably in the development of power components Experience in the mass production of semiconductor technology is advantageous Your hands-on mentality and open attitude towards intercultural work environments make it easy for you to quickly adapt to new environments In addition to excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous On behalf of a renowned client, we are currently seeking dedicated and talented individuals for an exciting direct placement into a permanent position with our client. The position can also be filled at the Munich location. If you want to take your career to the next level and have the required qualifications, we look forward to meeting you! Shape the future with us and apply today! What we offer: Responsible Tasks Flexible working hours Networking throughout the group Attractive compensation Team-oriented work Contact: Jessica Siermann Tel.: 01702297260 Contact: Jessica Siermann Tel.: 01702297260 www.bertrandt.com/en/career Apply online!

Qualifikation: Arbeitskräfte

Verdienst:: n.a.

Bewerbung an: Bertrandt AG
Am Strandkai 1
De 20457 Hamburg

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